Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
TAKAHASHI Hiroyuki and HIROHATA Kenji and HISANO Katsumi and KAWAKAMI Takashi and OZAWA Naoyuki and SASAHARA Kunihiko,Evaluation of Peel Strength of Lead-Free Solder Joints for Reflow-Flow Soldering,Journal of The Japan Institute of Electronics Packaging,1343-9677,The Japan Institute of Electronics Packaging,2005,8,4,301-307,https://cir.nii.ac.jp/crid/1390282679536776320,https://doi.org/10.5104/jiep.8.301