Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Won Youn Sung and Takahashi Masaharu,Study on Copper Interconnection on Low-k Dielectric Parylene-C Film by Hot-Embossing Combined with Damacene Process,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2009,12,3,248-251,https://cir.nii.ac.jp/crid/1390282679536932224,https://doi.org/10.5104/jiep.12.248