Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Ueta Nobuki and Sasaki Takuya and Miura Hideo,Structural Design of Three-dimensionally Stacked Silicon Chips Mounted by Flip Chip Technology for Minimizing Their Residual Stress,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2009,12,6,519-525,https://cir.nii.ac.jp/crid/1390282679537788032,https://doi.org/10.5104/jiep.12.519