Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Noguchi Kenji and Teramoto Atsushi and Yamada Muneo and Murakoshi Takayuki,Inspection Technique of Foreign Objects in BGA Solder Joint Using Oblique X-ray Computed Tomography,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2010,13,1,63-70,https://cir.nii.ac.jp/crid/1390282679537858176,https://doi.org/10.5104/jiep.13.63