Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
FUJINAMI Tomoyuki and KOU Kentei and HONMA Hideo,Formation of the Porous Film by Electroless Copper Plating.,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,1998,1,1,66-69,https://cir.nii.ac.jp/crid/1390282679537902848,https://doi.org/10.5104/jiep.1.66