Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
NAWAFUNE Hidemi and SHIBA Kazuhiro and AKAMATSU Kensuke and MIZUMOTO Shozo and UCHIDA Ei and OBATA Keigo,Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy from Methanesulfonate Bath for Pb-Free Soldering.,Journal of The Japan Institute of Electronics Packaging,1343-9677,The Japan Institute of Electronics Packaging,2002,5,2,146-151,https://cir.nii.ac.jp/crid/1390282679538229632,https://doi.org/10.5104/jiep.5.146