Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
YOKOZAWA Masami and HIDAKA Koji and OGASHIWA Toshinori and ARIKAWA Takatoshi,Development of Semiconductor Devices with Pb-Free Die-Bond Solder.,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2000,3,7,617-620,https://cir.nii.ac.jp/crid/1390282679538273024,https://doi.org/10.5104/jiep.3.617