著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Tomita Yoshihiro and Morifuji Tadahiro and Tomisaka Manabu and Sunohara Masahiro and Nemoto Yoshihiko and Sato Tomotoshi and Takahashi Kenji and Bonkohara Manabu,Cu Bump Interconnections in 20 μm-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI,JOURNAL OF CHEMICAL ENGINEERING OF JAPAN,00219592,公益社団法人 化学工学会,2003,36,2,119-125,https://cir.nii.ac.jp/crid/1390282679541529216,https://doi.org/10.1252/jcej.36.119