Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
NAKASO Akishi and KANEKO Youichi and OKAMURA Toshiroh,Surface treatment of copper innerlayer of multilayer boards by electroless copper plating technique.,Circuit Technology,0914-8299,The Japan Institute of Electronics Packaging,1988,3,3,164-169,https://cir.nii.ac.jp/crid/1390282679636581248,https://doi.org/10.5104/jiep1986.3.164