Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
二宮 孝文 and 沢田 博司 and 川原 公介 and 横谷 篤至 and 黒澤 宏,Dicing Process for Thin Silicon Wafer by Using Femtosecond-laser,"Journal of the Japan Society for Precision Engineering, Contributed Papers",13488724,The Japan Society for Precision Engineering,2004,70,12,1554-1558,https://cir.nii.ac.jp/crid/1390282680258058240,https://doi.org/10.2493/jspe.70.1554