Metal plating via electrochemical reduction of oxide layers formed by electrophoretic deposition

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  • KAMADA Kai
    Department of Materials Science and Engineering, Faculty of Engineering, Nagasaki University Department of Applied Chemistry, Faculty of Engineering, Kyushu University
  • ENOMOTO Naoya
    Department of Applied Chemistry, Faculty of Engineering, Kyushu University
  • HOJO Junichi
    Department of Applied Chemistry, Faculty of Engineering, Kyushu University

書誌事項

公開日
2009
資源種別
journal article
DOI
  • 10.2109/jcersj2.117.926
公開者
公益社団法人 日本セラミックス協会

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説明

A novel electroplating technique is proposed using simple and non-toxic aqueous solutions in contrast with conventional plating baths. The metal plating process consists of a two-step procedure, i.e., combination of well-known electrophoretic deposition (EPD) and electrochemical reduction. Initially, the EPD of metal oxide particles dispersed in pure water is performed so that an oxide layer can be formed on the electrode surface. The coating layer is then electrochemically reduced to the metallic state in a neutral electrolyte solution. Dissolution-precipitation of the oxide in the second step plays an important role in densification of the resultant metal film. This communication briefly discusses the electroplating mechanism and the effectiveness of the proposed technique.

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