Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Kubo Masahiro and Hazeyama Ichiro and Kabasawa Toshiya and Kitajyo Sakae and Matsui Koji and Igarashi Kazumasa,Development of reparable underfill resin for flip chip interconnection,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2002,17,0,109-109,https://cir.nii.ac.jp/crid/1390282680531896960,https://doi.org/10.11486/ejisso.17.0.109.0