Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Dohi Shigefumi and Okamoto Naoki and Kondo Kazuo,Development of the Ni-Fe alloy electrodeposition for Blind Via plating,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2007,21,0,111-113,https://cir.nii.ac.jp/crid/1390282680533313792,https://doi.org/10.11486/ejisso.21.0.111.0