[Updated on Apr. 18] Integration of CiNii Articles into CiNii Research

Micro Phenomena in Low Contact-Force Probing (2)

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Bibliographic Information

Other Title
  • 低接触力プロービングにおけるマイクロ現象(第2報)
  • 低接触力プロービングにおけるマイクロ現象(第2報):プローブ材料のコンタクト耐久性への影響
  • プローブ材料のコンタクト耐久性への影響

Abstract

New contact method without applying large force is required for testing of LSI devices of next generation. Fritting phenomena, which is a kind of electric breakdown, has been focused as a method for low-force contact probing. One of the advantages of fritting contact is less damage on the probe or on the electrode on the LSI devices. In our previous work, however, the electrode materials were found to adhere to the probe after hundreds of contacts. In this report, the characteristics of the contact duration and observation of adhesion to the probe will be reported using probes of different materials in order to discuss the influences of probe material on the contact duration.

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