Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Takasu Yoichi and Abe Tomoyuki,H122 Cooling Behavior of 3D Devices on PCB with Termal Via,The Proceedings of the Thermal Engineering Conference,2424-290X,The Japan Society of Mechanical Engineers,2012,2012,0,237-238,https://cir.nii.ac.jp/crid/1390282680856066048,https://doi.org/10.1299/jsmeted.2012.237