H122 3次元実装デバイスの放熱ビアを有する基板での放熱挙動(OS-8: 電子機器・デバイスの熱課題)

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  • H122 Cooling Behavior of 3D Devices on PCB with Termal Via

説明

3D devices which contain two or more chips stacked vertically and connected by through silicon via (TSV) will be required for high performance computer (HPC) systems. However heat dissipation is a critical issue because 3D devices are difficult to cool the lower layer chips. In this paper, cooling behavior of 3D devices mounted on printed circuit board (PCB) with thermal vias area is studied. It is confirmed that cooling from substrate side is effective to cool the lower layer chips in 3D devices.

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