著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Matsumoto Takuji and Satoh Masakazu and Sakuma Katsuyuki and Kurino Hiroyuki and Miyakawa Nobuaki and Itani Hikotaro and Koyanagi Mitsumasa,New Three-Dimensional Wafer Bonding Tecnology Using the Adhesive Injection Method,Japanese Journal of Applied Physics,00214922,The Japan Society of Applied Physics,1998,37,3B,1217-1221,https://cir.nii.ac.jp/crid/1390282681225940352,https://doi.org/10.1143/jjap.37.1217