Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Okuno Yae and Tamura Masao,"Direct Wafer Bonding of a (001) InP-Based Strained Multiple Quantum Well on a (110) Si Substrate with a GaAs Buffer Layer, Aligning Cleavage Planes of InP and Si.",Japanese Journal of Applied Physics,00214922,The Japan Society of Applied Physics,1996,35,12B,L1652-L1654,https://cir.nii.ac.jp/crid/1390282681226153344,https://doi.org/10.1143/jjap.35.l1652