Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Domon Takaaki,"In the 5G Era, Trends in Board and Peripheral Technology Initiatives for Next-Generation Vehicles and Communication Technologies",Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2019-11-01,22,7,592-595,https://cir.nii.ac.jp/crid/1390282752357048192,https://doi.org/10.5104/jiep.22.592