Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Hagio Koichi and Matsumura Fumio and Arita Yoshitaka and Yamato Jyunya,Solder paste which can be soldering and reinforcement by resin,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2014,28,0,163-165,https://cir.nii.ac.jp/crid/1390282763026696832,https://doi.org/10.11486/ejisso.28.0_163