Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yajima Naoyuki and Kariya Yoshiharu and Kikuchi Shunichi and Hiroshima Yoshiyuki and Matsui Akiko and Shimizu Hiroshi,Evaluation of Low Cycle Fatigue Properties of Electroplated Copper Thin Film for Through Hole Via,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2014,28,0,422-423,https://cir.nii.ac.jp/crid/1390282763026707200,https://doi.org/10.11486/ejisso.28.0_422