Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Hasegawa Kenichiro,Embedded device technology of PALAP process,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2014,28,0,110-111,https://cir.nii.ac.jp/crid/1390282763027004032,https://doi.org/10.11486/ejisso.28.0_110