The Defected Ground Structure for Mounting Chip Components to Improve Deterioration of Reflection Characteristics by an Interlayer Deviation

DOI

Bibliographic Information

Other Title
  • 積層ずれによる特性劣化を低減可能なチップ部品実装部の検討

Journal

Details 詳細情報について

  • CRID
    1390282763049611392
  • NII Article ID
    130007491007
  • DOI
    10.11486/ejisso.29.0_285
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles

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