The Defected Ground Structure for Mounting Chip Components to Improve Deterioration of Reflection Characteristics by an Interlayer Deviation
Bibliographic Information
- Other Title
-
- 積層ずれによる特性劣化を低減可能なチップ部品実装部の検討
Journal
-
- Proceedings of JIEP Annual Meeting
-
Proceedings of JIEP Annual Meeting 29 (0), 285-287, 2015
The Japan Institute of Electronics Packaging
- Tweet
Details 詳細情報について
-
- CRID
- 1390282763049611392
-
- NII Article ID
- 130007491007
-
- Text Lang
- ja
-
- Data Source
-
- JaLC
- CiNii Articles