Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Okitsu Hiroyuki and Koh Keishin and Hohkawa Kohji,2P3-8 A Basic Study on Mode Coupling SAW Device with Face to Face Bonding(Poster Session),Proceedings of Symposium on Ultrasonic Electronics,1348-8236,Institute for Ultrasonic Elecronics,2009-11-18,30,0,279-280,https://cir.nii.ac.jp/crid/1390282763068754816,https://doi.org/10.24492/use.30.0_279