Package Technology in IoT Era(WL-CSP,FO-WLP,TSV Technology)
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- 小林 治文
- IPTC(Integrated Packaging Technology Consult)
Bibliographic Information
- Other Title
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- IoT時代のパッケージ技術(鍵を握るWL-CSP、FO-WLP、TSV技術)
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 32 (0), 329-332, 2018
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282763118469376
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- NII Article ID
- 130007627555
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles