Improvement of Sampling Inspection for Wire Bonding Using Thin AE Sensor and Transfer Learning

DOI

Bibliographic Information

Other Title
  • 薄型AEセンサと転移学習を用いたワイヤボンディング抜取検査の性能向上

Journal

Details

  • CRID
    1390282763119234560
  • NII Article ID
    130007627630
  • DOI
    10.11486/ejisso.32.0_211
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles

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