Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
舟木 達弥 and 前田 剛伸 and 清野 紳弥 and 小幡 孝義 and 大竹 健介 and 高見 和憲 and 堀 良嗣 and 弘田 実保,Development of Flip Chip Bonding Technology using Ag Nanoparticles,Proceedings of Microelectronics Symposium,2434-396X,The Japan Institute of Electronics Packaging,2008,18,0,2A2-3,https://cir.nii.ac.jp/crid/1390287860632088192,https://doi.org/10.11486/mes.18.0_2a2-3