著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Donghui MA and Torii Tashiyuki and Shimizu Kenichi and Matsuba Akira,Fatigue Crack Propagation Evaluated by Electric Resistance and Ultrasonics in Copper Film Bonded to Base Metal with Resin,"Memoirs of the Faculty of Engineering, Okayama University",0475-0071,"Faculty of Engineering, Okayama University",2008-01,42,1,104-109,https://cir.nii.ac.jp/crid/1390290699562012800,https://doi.org/10.18926/14069