著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Homma Soichi and Takano Yuusuke and Watanabe Takeshi and Murakami Kazuhiro and Fukuda Masatoshi and Imoto Takashi and Nishikawa Hiroshi,Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages,MATERIALS TRANSACTIONS,13459678,公益社団法人 日本金属学会,2022-06-01,63,6,766-775,https://cir.nii.ac.jp/crid/1390292240166887552,https://doi.org/10.2320/matertrans.mt-mc2022001