著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Fukumoto Shinji and Nakamura Koki and Takahashi Makoto and Tanaka Yuto and Takahashi Shoya and Matsushima Michiya,Low-Temperature Bonding of Copper by Copper Electrodeposition,MATERIALS TRANSACTIONS,13459678,公益社団法人 日本金属学会,2022-06-01,63,6,783-788,https://cir.nii.ac.jp/crid/1390292240174892928,https://doi.org/10.2320/matertrans.mt-mc2022009