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A Study of Room-Temperature Bonding of SOI Wafer with Diamond-BOX Layer
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- Koga Yoshihiro
- SUMCO CORPORATION
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- Kurita Kazunari
- SUMCO CORPORATION
Bibliographic Information
- Other Title
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- 常温接合によるダイヤモンドBOX層SOIウェーハの検討
- Published
- 2018-03-05
- DOI
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- 10.11470/jsapmeeting.2018.1.0_1462
- Publisher
- The Japan Society of Applied Physics
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2018.1 (0), 1462-1462, 2018-03-05
The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1390293655507799296
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC