Analysis of Scanning Errors Formed during Inspection of Printed Circuit Boards by Eddy-Current testing Probe

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This paper reports an analysis of errors formed during an inspection of printed circuit boards (PCB). A unique probe suitable for this inspection, has been fabricated. Although the probe has high sensitivity, there are some additional obstacles, which have to be overcome - signals' separation and removal of not constant offset voltage from the output signal. In order to avoid misinterpretations of the signal obtained, the phase characteristic has been taken into account. The data from the phase characteristic are combined with the data coming from the amplitude characteristic. Thereby, information about defects, obtained from phase characteristic, can be confirmed with the information about defects delivered by the amplitude characteristic. Experimental results presented in this paper show good accuracy of this analysis method.

特集 第9回MAGDAコンファレンス

source:https://www.jstage.jst.go.jp/browse/jsaem/

source:http://www.jsaem.gr.jp/

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