Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Ukawa Ken,Packaging Technology of Semiconductor Device,JSAP Annual Meetings Extended Abstracts,2436-7613,The Japan Society of Applied Physics,2021-02-26,2021.1,0,188-188,https://cir.nii.ac.jp/crid/1390573947549936384,https://doi.org/10.11470/jsapmeeting.2021.1.0_188