Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yamada Yasushi and Yasaka Shinichi and Ohura Kenichi and Tojoh Mitsuaki,Evaluation Methods of Fundamental Properties and Reliabilities of Joining Materials for Power Semiconductor Devices,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2023-01-01,26,1,158-166,https://cir.nii.ac.jp/crid/1390576118542266496,https://doi.org/10.5104/jiep.jiep-d-22-00053