Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Tomohiko Kotake,Technological Trend of Low-loss Materials for IC Packages,"Journal of Networkpolymer,Japan",2433-3786,Japan Thermosetting Plastics Industry Association,2023-01-10,44,1,27-34,https://cir.nii.ac.jp/crid/1390576424444105600,https://doi.org/10.11364/networkedpolymer.44.1_27