Establishment of “JOINT2” Consortium for Next Generation Semiconductor Package Evaluation and Development of Packaging Technology

DOI Web Site 4 References
  • Ueno Keiko
    Packaging Solution Center, Electronics Business Headquarters, Resonac Corporation
  • Katoh Sadaaki
    Packaging Solution Center, Electronics Business Headquarters, Resonac Corporation

Bibliographic Information

Other Title
  • 次世代半導体パッケージ評価コンソーシアム“JOINT2”の構築とパッケージング技術の開発

Journal

References(4)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top