Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
江川 智哉 and 小畑 貴慎 and 板谷 亮 and 菅沼 克昭,Voidless bonding Ag paste and new Cu paste,Proceedings of JIEP Annual Meeting,,The Japan Institute of Electronics Packaging,2022,36,0,23C2-6,https://cir.nii.ac.jp/crid/1390579675966027008,https://doi.org/10.11486/ejisso.36.0_23c2-6