Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yoshiki Nakamura,Development of high heat-resistance molding compound material for power semiconductors,"Journal of Networkpolymer,Japan",2433-3786,Japan Thermosetting Plastics Industry Association,2024-03-10,45,2,112-118,https://cir.nii.ac.jp/crid/1390581179980747648,https://doi.org/10.11364/networkedpolymer.45.2_112