Application of Modified Strain Hardening Rule to Thermal Fatigue Strength Evaluation of Wire Bonding in Power Module

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  • HAYAMA Yutaka
    Department of Mechanical Engineering, Faculty of Science and Engineering, Saga University Former Affiliation : Green Electronics Research Institute, Kitakyushu
  • SHISHIDO Nobuyuki
    Department of Mechanical Engineering, Faculty of Science and Engineering, Kindai University Former Affiliation : Green Electronics Research Institute, Kitakyushu
  • USHIO Kazuya
    Department of Mechanical Engineering, Graduate School of Engineering, Saga University
  • HAGIHARA Seiya
    Department of Mechanical Engineering, Faculty of Science and Engineering, Saga University
  • MIYAZAKI Noriyuki
    Department of Mechanical Engineering, Faculty of Science and Engineering, Saga University Former Affiliation : Green Electronics Research Institute, Kitakyushu

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Other Title
  • パワーモジュール・ワイヤ接合部熱疲労強度評価に修正ひずみ硬化則の適用
  • パワーモジュール ・ ワイヤ セツゴウブ ネツ ヒロウ キョウド ヒョウカ ニ シュウセイヒズミ コウカソク ノ テキヨウ

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Description

Power modules are used for all types of electric power control and key devices for energy saving. One of the important parts for a power module is the wire-to-semiconductor chip joint. This joint is subjected to repeated temperature cycles, and repeated thermal stress acts on the joint due to the difference in coefficient of linear thermal expansion between a wire and a die material. Wire-liftoff is the thermal fatigue caused by such repeated thermal stress. In recent years, power modules are expected to be used at high temperatures of 200℃ or higher. Finite element analysis considering both creep and plastic behavior is a powerful tool for evaluating the wire-liftoff lifetime. Stress reversal occurs in a bonding wire under a repeated thermal stress condition. It is known that the modified strain hardening rule should be utilized in the transient creep analysis instead of the conventional strain hardening rule. In this paper, we performed the fund amental study on the application of the modified strain hardening rule to wire-liftoff phenomenon for an Al wire-Si die system.

Journal

  • Journal of Smart Processing

    Journal of Smart Processing 9 (5), 216-223, 2020-09-10

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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