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A Study of SOI Wafer with SiC-BOX Layer using Room-Temperature Bonding
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- Koga Yoshihiro
- SUMCO CORPORATION
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- Kurita Kazunari
- SUMCO CORPORATION
Bibliographic Information
- Other Title
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- 常温接合によるSiC-BOX層SOIウェーハの検討
- Published
- 2019-02-25
- DOI
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- 10.11470/jsapmeeting.2019.1.0_1274
- Publisher
- The Japan Society of Applied Physics
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2019.1 (0), 1274-1274, 2019-02-25
The Japan Society of Applied Physics
- Tweet
Keywords
Details 詳細情報について
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- CRID
- 1390856152137988608
-
- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC