著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Thwaites C. J.,"4-2 Soldering microelectronic assemblies : some problems and studies(Session 4 : New Joining Processes for Advanced Materials,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)",Transactions of JWRI,03874508,大阪大学溶接工学研究所,1988-05,17,1,129-134,https://cir.nii.ac.jp/crid/1390857202732451072,https://doi.org/10.18910/7280