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Product Design of Silicon Wafers for 3D Stacked CMOS Image Sensor (II) – Photoemission Spectroscopy Study on Variation in SiO<sub>2</sub>/Si Interfacial Strain with Annihilation of Interface State Defects –
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- Suzuki Akihiro
- SUMCO CORPORATION
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- Kadono Takeshi
- SUMCO CORPORATION
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- Okuyama Ryosuke
- SUMCO CORPORATION
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- Hirose Ryo
- SUMCO CORPORATION
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- Masada Ayumi
- SUMCO CORPORATION
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- Kobayashi Koji
- SUMCO CORPORATION
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- Kurita Kazunari
- SUMCO CORPORATION
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- Takahashi Kazutoshi
- Synchrotron Light Application Center, Saga Univ.
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- Koga Yoshihiro
- SUMCO CORPORATION
Bibliographic Information
- Other Title
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- 3次元積層型CMOSイメージセンサ向けSiウェーハの製品設計（Ⅱ） –SiO<sub>2</sub>/Si界面準位欠陥の消滅に伴う歪み状態変化の光電子分光分析–
- Published
- 2022-02-25
- DOI
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- 10.11470/jsapmeeting.2022.1.0_2806
- Publisher
- The Japan Society of Applied Physics
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2022.1 (0), 2806-2806, 2022-02-25
The Japan Society of Applied Physics
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Keywords
Details 詳細情報について
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- CRID
- 1390866882742464640
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC
