Product Design of Silicon Wafers for 3D Stacked CMOS Image Sensor (II) – Photoemission Spectroscopy Study on Variation in SiO<sub>2</sub>/Si Interfacial Strain with Annihilation of Interface State Defects –

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  • 3次元積層型CMOSイメージセンサ向けSiウェーハの製品設計（Ⅱ） –SiO<sub>2</sub>/Si界面準位欠陥の消滅に伴う歪み状態変化の光電子分光分析–

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