Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Hara Tomoaki and Aoki Yoshitaka and Funaki Tsuyoshi,Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module,Journal of The Japan Institute of Electronics Packaging,13439677,The Japan Institute of Electronics Packaging,2021-01-01,24,1,130-142,https://cir.nii.ac.jp/crid/1391131406295191808,https://doi.org/10.5104/jiep.jiep-d-19-00122