Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Hong-Ching Lin and Pang Lin and Chun-An Lu,Microstructure and electrical resistivity of low-temperature-cured silver films prepared using silver oxide and silver stearate pastes,Japanese journal of applied physics : JJAP,00214922,Tokyo : The Japan Society of Applied Physics,2009-01,48,1,016501,https://cir.nii.ac.jp/crid/1520009407244788992,https://doi.org/10.1143/jjap.48.016501