Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yi-Lung Cheng and Ming-Kai Shiau and Wei-Yuan Chung,Effect of electron flow direction and via number on electromigration mechanism for copper dual damascene interconnects,Japanese journal of applied physics : JJAP,00214922,Tokyo : The Japan Society of Applied Physics,2010-12,49,12,124201,https://cir.nii.ac.jp/crid/1520009408564616320,https://doi.org/10.1143/jjap.49.124201