Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Jeong-Kyu Kim and Hee-Oh Kang and Wook-Jung Hwang,Effect of Post-Chemical-Mechanical Polishing Surface Treatments on the Interfacial Adhesion Energy between Cu and a Capping Layer,Japanese journal of applied physics : JJAP,00214922,Tokyo : The Japan Society of Applied Physics,2013-10,52,10,,https://cir.nii.ac.jp/crid/1520290882515531520,