著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Byung-Ho Kim and Cheol-Hee Moon,Investigation of the Thermal Dissipation Characteristics of a Light-Emitting Diode Package Using Mold Surface Temperature,Japanese journal of applied physics : JJAP,00214922,Tokyo : The Japan Society of Applied Physics,2013-10,52,10,,https://cir.nii.ac.jp/crid/1520572357855060096,