Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Wei FENG and Naoya WATANABE and Haruo SHIMAMOTO and Masahiro AOYAGI and Katsuya KIKUCHI,招待講演 Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV),電子情報通信学会技術研究報告 = IEICE technical report : 信学技報,09135685,東京 : 電子情報通信学会,2019-02-07,118,438,9-14,https://cir.nii.ac.jp/crid/1520853832059568512,