Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
C.-H. Cho and H.-Y. Cha,Strain effects in van der Pauw (VDP) stress sensor fabricated on (111) silicon in electronic packages,電子情報通信学会技術研究報告 = IEICE technical report : 信学技報,09135685,東京 : 電子情報通信学会,2009-06,109,97,165-168,https://cir.nii.ac.jp/crid/1520853832146165504,